Back to Community News
Since 2000, the US-Japan Leadership Program has been devoted to developing a network of friendship, communication and understanding among the next generation of leaders in our two countries. Over the course of two summers, 40 young leaders are brought together to form meaningful exchanges around important topics of unique and mutual interest. Once selected for the Program, participants gain lifelong access to the unique pool of USJLP talent, connections and opportunities.
To qualify for the 2023-2024 USJLP conferences, candidates must hold U.S. or Japan citizenship, be between the ages of 28 and 44* as of the first day of the 2023 conference (July 23, 2023), and have demonstrated leadership and achievement in their respective fields. USJLP strives to achieve a diverse and balanced class each year, and consideration will be given to leaders from a broad spectrum of careers and backgrounds.
The 22nd Annual Conference will be held in Kyoto and Tokyo from July 23-30, 2023. Delegates who start the Program in 2023 are expected to return for their second year at the 2024 Conference, to be held at a TBA time and location in the U.S. in July 2024 (planned). Learn more about USJLP conferences here.
To learn more about nominating a prospective candidate or supporting the candidacy of someone applying for USJLP, please click here.
The application deadline is Monday, December 5, 2022. The Foundation intends to notify applicants of results in February 2023.
Interested candidates are invited to submit a CV, personal statement, recommendation letter, and an application cover sheet. Visit the USJLP Applications page for complete details and necessary documents.
*Note on temporary upper age permission for the 2023-2024 cycle: An upper age of 44 is being permitted this cycle as a special, one-time accommodation for candidates who otherwise could not apply during the Program’s COVID-19 operations hiatus over 2020 and 2021. Age eligibility will return to 28-42 following the close of this cycle on December 5, 2022.
